ROCKVILLE, Md. — Ceva, Inc. (NASDAQ: CEVA), the leading licensor of silicon and software IP for the Smart Edge, today announced its financial results for the second quarter ended June 30, 2026. Total ...

Samsung Foundry has been consistently upgrading its chip-making tools. However, despite the availability of the new generation of EUV lithography, the company has not yet committed to using High-NA ...

BrainChip CEO Sean Hehir was featured in the August 2026 issue of Drones World Magazine, sharing his perspective on how edge AI and neuromorphic computing are transforming autonomous drones. The ...

Siemens EDA, in collaboration with NVIDIA, has unveiled an "AI-Native Design" strategy that embeds artificial intelligence throughout the entire semiconductor design process. The company has built a ...

As SoC designs continue to grow in complexity, the communication infrastructure connecting various IP blocks becomes increasingly important. Traditional crossbar-based interconnect architectures have ...

Received a feasibility study contract to evaluate QuickLogic eFPGA IP for potential architectural license Received a contract to develop and qualify new packaging for QuickLogic OTP discrete FPGAs to ...

Nordic Semiconductor has announced a new route to faster deployment of satellite-enabled IoT devices, following the certification of LooUQ's MTC2-N9151 embedded modem for Skylo's Non-Terrestrial ...

Siemens EDA outlined how artificial intelligence (AI) can reduce semiconductor design time by as much as tenfold, highlighting multi-agent AI as a key technology for addressing the growing complexity ...

Comcores, a leading provider of Ethernet IP and security solutions, is contributing to RIGOLETTO with its small-footprint MACsec and RISC-V based Root of Trust IP. The European research and innovation ...

The July/August issue takes a look at advances happening at the component level that are enabling next-generation automotive technologies. These range from zonal microcontrollers (MCUs) and gallium ...

Recently, the "AI ASIC Chip Design Platform R&D and Application" project independently developed by Joinsilicon Microelectronics (Beijing) Co., Ltd. completed the registration of scientific and ...

Movellus provides critical power and performance optimization technology integrated into an array of applications, ranging from edge AI devices to performance-centric cloud data center compute and ...