Tenstorrent QuietBox tested: A high-performance RISC-V AI workstation trapped in a software blackhole

The $12K machine promises AI performance can scale to 32 chip servers and beyond but an immature software stack makes ...
Commercial Integrator

D-Tools Launches Interconnect Diagrams for D-Tools Cloud

D-Tools, provider of end-to-end software solutions for the professional integration industry, announced the launch of Interconnect Diagrams in D-Tools Cloud, a new feature that gives integrators an ...

Amazon’s Trainium3 is the latest to conform to Nvidia’s mold

Amazon has deployed a ton of Nvidia's GB200 and GB300 NVL72 racks, and given the visual similarities to its Trainium3 Ultra ...

Broadcom: This AI Stock Is Set To Surge From Inference Demand

Broadcom's custom silicon and strong Q3 results set it apart in the semiconductor industry. Read here for an investment ...
Electronic Design

Multiprotocol Wireless SoCs Untangle the IoT (Part 1)

The latest multiprotocol wireless SoCs aim to connect unconnected “things” with a single chip. This roundup spotlights some ...
IEEE

EIGEN: Enabling Efficient 3DIC Interconnect with Heterogeneous Dual-Layer Network-on-Active-Interposer

Abstract: Chiplet-based 3DICs have emerged as modular solutions for large-scale, high-performance computing systems. However, unlike monolithic Network-on-Chips (NoCs), 3DICs using active interposers ...